CFET technology 結果共1筆

TSMC, the Taiwanese semiconductor manufacturing company, announced progress in the development of its 1.4nm-class technology node, A14, during the IEEE International Electron Devices Meeting. The company plans to begin volume production of its 2nm process chips, N2, in 2025, with the N2P process expected to reach mass production by the end of 2026. Market analysts predict that TSMC’s A14 process could debut between 2027 and 2028. While TSMC is also developing cutting-edge technologies like CFETs to boost chip performance and energy efficiency, the initial A14 process is expected to use GAAFETs technology. The use of High-NA EUV lithography technology in TSMC’s future processes, including the A14 process, remains unconfirmed. Other industry players like Intel are also adopting next-generation EUV technology with a numerical aperture of 0.55.